Characterization Methodology for High-Density Microwave Fixtures

This paper presents the characterization of a PCI-express test fixture that was created to passively probe a x16 link on a PCB. This fixture plugs into the 48-pin, midbus footprint which has been adopted by as the industry standard for observing PCIexpress links on a PCB. This fixture is used to observe signals and pass them to a piece of test equipment (TDR, VNA, or oscilloscope). Engineers reading this paper will be exposed to how a Microwave test fixture with a high density interconnect was designed, measured, and modeled which ultimately resulted in the performance specifications of the fixture. Author(s) Biography Dr. Brock J. LaMeres received his BSEE from Montana State University in 1998 and his MSEE and Ph.D. from the University of Colorado in 2001 and 2005 respectively. He is currently an assistant professor in the Electrical and Computer Department at Montana State University, Bozeman. LaMeres is the co-founder of Probing Technology, Inc, a company which specializes in the design of high performance probing interconnect systems for use in Test and Measurement. LaMeres’ research and teaching interests are in the area of high speed digital system design and digital signal processing using FPGA’s. Prior to joining MSU, LaMeres was an R&D engineer at Agilent Technologies for 8 years where he designed acquisition and probing systems for Logic Analyzers. LaMeres has published over 40 papers in the area of high speed signal propagation and has been granted 9 US patents in the area of electronic probing interconnect. Brent A. Holcombe received his BSME from the University of Washington in 1996. Holcombe is also the co-founder of Probing Technology, Inc, a company which specializes in the design of high performance probing interconnect systems for use in Test and Measurement. Prior to joining Probing Technology, Holcombe was an R&D engineer at Hewlett-Packard and Agilent Technologies for 10 years where he designed interconnect and probing solutions for Logic Analyzers and Oscilloscopes. Holcombe has published 3 papers in the area of high speed interconnect solutions and has been granted 16 US patents in the area of electronic and mechanical probing interconnect. Emad Soubh Holds 2 BS one in Mechanical engineering and the second in Plastic engineering, also received his MBA from WA. State University 1996. Emad has been in the field of high speed interconnects filed, specifically in the Test and Measurements Industry, for 17 years, and holds 14 patents in that filed. Emad Holds the position of High speed cable Technology manager at Samtec. Inc. for the last 4 years. Prior to Samtec Emad held the position of Technical Lead at Precision Interconnect/Tyco for 13 years.